Synopsys Launches High-Performance 40G UCIe Solution To Accelerate Multi-Die AI Systems

The Synsopsys 40G UCIe IP affords up to 12.9Tbps per mm of data to efficiently travel between heterogeneous and/or homogeneous chiplet dies, with minimal silicon footprint. Higher bandwidth between chiplets is critical for enabling next-generation processor designs, and advanced AI and automotive ADAS systems, which must move massive amounts of data. Of note is that, despite its higher performance, Synopsys’ IP remains compliant with the UCIe 2.0 specification.

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Unpacking AI’s Power Problem And What AMD Is Doing To Fix It

In a conversation with AMD’s Mark Papermaster, chief technology officer and executive vice president for technology and engineering, I got a bird’s eye view regarding AMD’s philosophy and long-term sustainability and efficiency efforts. I also had a chance to connect with AMD’s Sam Naffziger, senior vice president, corporate fellow, for a deep-dive technical discussion detailing AMD’s past achievements and what it’s actively doing to maximize AI and HPC compute capabilities, though silicon and system-level optimizations and software co-optimization up and down the stack. Our discussions were eye opening.

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Intel Lunar Lake Processors Shake-Up The AI PC Landscape

Last week, at one of the oldest consumer electronics industry shows, analysts and press were given hands-on access to Lunar Lake Core Ultra laptops from various OEM partners, along with a deep-dive view of Core Ultra 200V Series processor performance, delivered in a series of presentations and Q&A sessions. The promise of what Lunar Lake will deliver was very strong, so much so that competitors like Qualcomm immediately began picking apart some of the compares. This was to be expected of course, but let’s break down what you can expect from Lunar Lake and read between the lines a bit along the way as well.

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Dave AltavillaIntelComment
Tenstorrent Unveils New Wormhole DevKits And Powerful AI Workstations

AI chip firm Tenstorrent, led by renowned microprocessor engineer Jim Keller, just announced new devkits and AI workstations powered by the company’s leading-edge Wormhole accelerators. Tenstorrent has previously offered devkits (development kits) based on its Grayskull AI processor (and will continue doing so while inventory is available), but Wormhole features a newer, more-powerful architecture, and this marks the first time the company has offered complete workstations built around its chips.

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AMD Blitzes Computex With AI, From Mobile To Desktops And Data Centers

In the resounding buzz that AI stirred at Computex 2024 in Taiwan, literally all of the major semiconductor players had something to say, though not all had new technologies that will shape this burgeoning new landscape. AMD, on the other hand, stepped out with a full arsenal of new chip technologies targeted at AI-fueled computing from the client edge to gaming desktops and workstation, and the AI-infused data center.

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Intel Lunar Lake Set To Accelerate The Next Wave Of AI PC Revolution

Lunar Lake represents a major architectural shift for Intel, manufactured on TSMC’s N3 and N6 chip fab process nodes, in an effort to leap ahead of new entrant competition from both Qualcomm and AMD. And to say both members of the media and analyst communities were waiting with baited breath for this level of detail on Intel’s new ultra-efficient processor architecture, for the age of the AI PC, would be a major understatement.

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Cadence Supercharges Chip Debug And Prototyping With Palladium Z3 And Protium X3 Systems

Cadence Design Systems, launched its latest systems for chip designers for hardware debugging and advanced prototyping, the Palladium Z3 and Protium X3. Though the systems are fundamentally different, each offers significantly increased capacity and higher performance versus its predecessors, to accelerate the development of today’s larger and more complex chips.

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Tenstorrent Scores Big Design Win With Japan’s LSTC To Enable Leading-Edge 2nm AI Accelerator

In an announcement made yesterday, the LSTC, in conjunction with Tenstorrent and Rapidus Corporation, revealed a multi-tiered partnership to license and leverage Tenstorrent’s leading RISC-V technologies and chiplet IP for LTSC’s planned 2nm AI Accelerator for the edge. In addition to the IP licensing part of the agreement, Tenstorrent will also collaborate with LSTC to help co-design the chip…

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