Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon. Printed circuit boards, advanced packaging, power delivery, thermal management, materials and mechanical structures are all critical to system performance and reliability as well, and co-optimization of all aspects of a design is effectively a requirement today.

Cadence Design Systems believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just announced its new AuraStack AI Super Agent, an agentic AI platform for PCB and advanced chip packaging.